Infineon’s new H-DPAK puts a 750 V CoolSiC half-bridge in a top-side-cooled package for EV OBCs and DC-DC converters

Infineon has launched the H-DPAK, a novel packaging solution that integrates a 750 V CoolSiC G2 silicon carbide (SiC) MOSFET half-bridge into a single, top-side-cooled module. This innovation targets power conversion systems in electric vehicles and industrial applications, such as on-board chargers (OBCs), DC-DC converters, and EV auxiliary power units. By combining the high-side and low-side switches within one package, the H-DPAK simplifies circuit design and assembly compared to traditional discrete component layouts. The design incorporates a split lead frame with optimised drain pads, which enhances thermal management by improving heat dissipation and minimising parasitic loop inductance. This reduction in inductance is crucial for mitigating switching noise and voltage ringing, especially at the high dv/dt rates enabled by SiC technology. The package’s geometry is compatible with existing board designs, matching the 2.3 mm height of Infineon’s Q-DPAK and TOLT packages, allowing for straightforward integration without the need for PCB redesign. Infineon emphasises the H-DPAK’s suitability for liquid cooling setups due to its top-side cooling orientation, which supports dense power stage configurations commonly found in EV powertrains and industrial systems. The underlying 750 V CoolSiC G2 MOSFET technology offers benefits such as low gate charge, which reduces gate drive losses, high dv/dt capability, and a wide gate-bias tolerance, all contributing to improved efficiency and reliability in demanding power conversion environments. This development reflects a broader trend in the electric mobility sector towards more compact, efficient, and thermally robust power electronics. By integrating the half-bridge in a single package with enhanced cooling and electrical performance, Infineon’s H-DPAK could accelerate the adoption of SiC devices in automotive on-board chargers and other high-voltage power modules. The solution promises to streamline design processes while supporting the increasing power density and thermal demands of next-generation electric vehicle systems.